Experimental study on the thermal response of PCM-based heat sink using structured porous material fabricated by 3D printing

Phase change material (PCM) based heat sink has the potential to be applied for thermal management of electronic devices. Whereas, PCM suffers from a low conductivity, which results in local overheating at base sink. To enhance performance sink, structured porous (SPM) used as conductivity enhancer (TCE) is designed and fabricated, where 3D printing technique adopted achieve fast precise manufacture SPM. The response using SPM with different porosities (80%, 85%, 90%, 95%) experimentally investigated various heating power levels (8 W, 10 12 W). Results show that use significant effect on cooling system. Furthermore, behavior can further heightened by reducing porosity SPM, e.g., 80% shows highest enhancement ratio all cases present study. increase level result reduction operation time PCM-based This study great significance design application unit.